WL BGA Chip Reballing Stencil 0.12mm Thickness Tin Mesh Solder Template for Huawei MTK MT7 MTS P8 C7 C8 71 5S MT8 P9

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For Huawei MT7 MT8 MTS P8 G7 G8 7I 5S P9 BGA Reballing Stencil Kit Direct Heating Template 0.12mm Thickness

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Reliability – 72%

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WL BGA Chip Reballing Stencil 0.12mm Thickness Tin Mesh Solder Template for Huawei MTK MT7 MTS P8 C7 C8 71 5S MT8 P9 2024 - buy cheap

WL BGA Chip Reballing Stencil 0.12mm Thickness Tin Mesh Solder Template for Huawei MTK MT7 MTS P8 C7 C8 71 5S MT8 P9 - compare prices

WL BGA Chip Reballing Stencil 0.12mm Thickness Tin Mesh Solder Template for Huawei MTK MT7 MTS P8 C7 C8 71 5S MT8 P9 - specifications

WL BGA Chip Reballing Stencil 0.12mm Thickness Tin Mesh Solder Template for Huawei MTK MT7 MTS P8 C7 C8 71 5S MT8 P9 - photo 2024

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Product specifications

Particle Size: 1-10μm

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