Kaisi BGA Reballing Stencil Kit 0.12mm Thickness for IPhone 6 6s 7g 8P X XS 11 Pro Max IC Chip Reballing Repair Solder Template

6.29 – 22.68 $

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Price dropped by 0.72 $

Lower than average, a bit

-3%

Seller reliability: 72%

Above average, safe to buy, FonLogic Store

More than 3 years of seller experience
Medium general feedback score (1000)
Customers are satisfied by communication
Items match description
High shipping speed
2.8% of customers were dissatisfied over the last 3 months

Prices at other sellers from 4 $

4.00 $

BGA Stencil for iPhone XS Max XS XR X 8P 8 7P 7 6SP 6S IC Chip Motherboard Reballing Kit Set Solder Template 0.12mm Thickness

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Reliability – 72%

Seller HandyMan Store

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10.40 – 40.00 $

Kaisi 0.12mm BGA Reballing Stencil Kit Set Solder Template for iPhone CPU A8 A9 A10 A11 A12 A13 11 Pro Max XS XR X 8 8P 7P 6S 6

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Reliability – 66%

Seller Shop5871491 Store

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Kaisi BGA Reballing Stencil Kit 0.12mm Thickness for IPhone 6 6s 7g 8P X XS 11 Pro Max IC Chip Reballing Repair Solder Template 2024 - buy cheap

Kaisi BGA Reballing Stencil Kit 0.12mm Thickness for IPhone 6 6s 7g 8P X XS 11 Pro Max IC Chip Reballing Repair Solder Template - compare prices

Kaisi BGA Reballing Stencil Kit 0.12mm Thickness for IPhone 6 6s 7g 8P X XS 11 Pro Max IC Chip Reballing Repair Solder Template - specifications

Kaisi BGA Reballing Stencil Kit 0.12mm Thickness for IPhone 6 6s 7g 8P X XS 11 Pro Max IC Chip Reballing Repair Solder Template - photo 2024

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Product specifications

Particle Size: 1-10μm

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