MECHANIC 3D BGA Reballing Stencil Kit for iPhone X Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net

16.59 $
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Price increased by 0.16 $

Higher than average, a bit

Reliable seller: 100%

You can safely buy here, Shenzhen Winnertech Electronic technology co., LTD

  • More than 9 years of seller experience
  • High general feedback score (10466)
  • Customers are satisfied by communication
  • Items match description
  • High shipping speed
  • 1.4% of customers were dissatisfied over the last 3 months

Prices at other sellers from 3.37 $

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MECHANIC 3D BGA Reballing Stencil Kit for iPhone X Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net 2024 - buy cheap
MECHANIC 3D BGA Reballing Stencil Kit for iPhone X Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net 2024 - buy cheap
MECHANIC 3D BGA Reballing Stencil Kit for iPhone X Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net - compare prices
MECHANIC 3D BGA Reballing Stencil Kit for iPhone X Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net - specifications
MECHANIC 3D BGA Reballing Stencil Kit for iPhone X Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net - photo 2024
MECHANIC 3D BGA Reballing Stencil Kit for iPhone X Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net - photo 2024
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Product specifications

  • Brand Name: MECHANIC
  • Particle Size: 1-10μm
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