865 SM8250 CPU RAM For xiaomi 10/10 pro/Redmi K30 Pro Power ADUIO pm IC Chip BGA Reballing Stencil Solder BGA Heating Template
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Bga stencil for iphone 11/pro/max a13 cpu ic chip bga reballing stencil kit
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Product specifications
- Origin: CN(Origin)
- Certification: CE
- Particle Size: 1-10μm
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