Mijing 3D Groove BGA Reballing Stencil A13 A12 A11 A10 A9 A8 CPU Repair Plate for Phone 11 pro max 11 XS XSMAX Tin Plating
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Price dropped by 5.42 $
Lower than average, a lotReliable seller: 89%
Above average, safe to buy, WeTradeTek Store
- More than 5 years of seller experience
- High general feedback score (1980)
- Customers are satisfied by communication
- Items match description
- High shipping speed
- 2.4% of customers were dissatisfied over the last 3 months
Prices at other sellers from 5.98 $
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Bga stencil for iphone 11/pro/max a13 cpu ic chip bga reballing stencil kit
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1rating
1order
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Product specifications
- Particle Size: 20-38μm
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